JC-11 is responsible for the creation and update of the registered and standard outlines in JEDEC Publication 95.
The committee and its subcommittees generate design guidelines, standardized measuring methods for mechanical features, and standard- or registration-type mechanical outlines for microelectronic packages and assemblies, corresponding socket outlines, mechanical, environmental and ergonomic performance specifications, footprints and land patterns, and development of designators for semiconductor device packages. To accomplish these functions, the committee provides technical support and design recommendations to establish and define parameters that ensure mechanical interchangeability of parts.
Find JC-11’s complete scope in JM18: JEDEC Committee Scope Manual.
|Registration - Ball Grid Array Family, Rectangle, 0.75 mm Pitch||MO-328A||Jan 2017|
|Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.||MS-034G||Jan 2017|
|Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA||MO-318B||Jan 2017|
|Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.||MO-234C||Jan 2017|
|Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON).||DG-4.20F||Sep 2016|
|Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF||MO-327A||Sep 2016|
|Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN)||DG-4.24B||Aug 2016|
|Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA)||DG-4.25B||Aug 2016|
|Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.||MO-302C||Aug 2016|
|Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA||MO-324A||Aug 2016|
|JC-11.10||Microelectronic Ceramic Packages|
|JC-11.11||Microelectronic Plastic Packages|