JC-11 is responsible for the creation and update of the registered and standard outlines in JEDEC Publication 95.
The committee and its subcommittees generate design guidelines, standardized measuring methods for mechanical features, and standard- or registration-type mechanical outlines for microelectronic packages and assemblies, corresponding socket outlines, mechanical, environmental and ergonomic performance specifications, footprints and land patterns, and development of designators for semiconductor device packages. To accomplish these functions, the committee provides technical support and design recommendations to establish and define parameters that ensure mechanical interchangeability of parts.
Find JC-11’s complete scope in JM18: JEDEC Committee Scope Manual.
|Registration - Fine Pitch Ball Grid Array Family, Rectangular, 0.80 mm Pitch. (V,T,L)FR-XBGA.||MO-210L||May 2013|
|DESCRIPTIVE DESIGNATION SYSTEM FOR SEMICONDUCTOR-DEVICE PACKAGES:||JESD30F||Apr 2013|
|Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA||MO-304C||Apr 2013|
|Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN)||DR-4.24A.1||Apr 2013|
|Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDX||MO-305B||Mar 2013|
|Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors||SPP-023B||Feb 2013|
|Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIM||MO-274C||Dec 2012|
|Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.||MO-269H||Dec 2012|
|REGISTRATION - DDR4 DIMM Press Fit 284 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-019A||Dec 2012|
|Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline.||SO-008B||Oct 2012|
|JC-11.10||Microelectronic Ceramic Packages|
|JC-11.11||Microelectronic Plastic Packages|