JC-10 created and maintains the JEDEC Dictionary of Terms for Solid State Technology, JESD88. A fully searchable online version can be found here. This popular resource for technical writers, educators, manufacturers, and buyers and users of discrete solid state devices is intended to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry. With approximately two thousand entries all referenced to their source publications; the long-term goal of incorporating definitions from all JEDEC publications and standards has largely been met. As new terms and definitions are defined by JEDEC committees, reviewed by JC-10, and approved by the JEDEC Board of Directors, they are incorporated into the Dictionary.
Find JC-10’s complete scope in JM18: JEDEC Committee Scope Manual.
|Design Requirements - Ball Grid Array Package (BGA).||DG-4.14H||Mar 2015|
|Registration - mSATA SSD Assembly. DIM.||MO-300C||Mar 2015|
|Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch. TFR-XBGA.||MO-246G||Feb 2015|
|Design Requirements - Fine Pitch Ball Grid Array Package (FBGA)||DR-4.27C||Feb 2015|
|Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch||SO-021A||Feb 2015|
|Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA||MO-315A||Feb 2015|
|Design Requirements - Fine Pitch/Fine Pitch Interstitial Ball Grid Array Packages (FBGA) and (FIBGA)||DR-4.5J||Jan 2015|
|Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.||MO-286B||Jan 2015|
|Registration - Fine Pitch Ball Grid Array Family, Rectangular , 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.||MO-276I||Dec 2014|
|Registration - Dual-Pitch, Thin and Very Thin Profile, Rectangular Die Size BGA, 0.80 mm X 0.65 mm Pitch. (T,V)FR-xDSBGA||MO-311D||Dec 2014|