JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
|Registration - Dual-Pitch, Thin and Very Thin Profile, Rectangular Die Size BGA, 0.80 mm X 0.65 mm Pitch. (T,V)FR-xDSBGA||MO-311C||Aug 2014|
|Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA||MO-313A||Aug 2014|
|Standard - Plastic Ball Grid Array Family, Square, 1.0 mm, 1.27 mm, 1.5 mm Pitch. S-PBGAB/PBGA.||MS-034E||Jul 2014|
|Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM||MO-309E||Jul 2014|
|Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-017C||Jul 2014|
|Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-016C||Jul 2014|
|REGISTRATION - DDR4 DIMM Press Fit 288 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-019C||Jul 2014|
|Standard Practices and Procedures - Grid Array Terminal Position Numbering||SPP-010B||May 2014|
|Design Registration - Fine Pitch Square Ball Grid Array Package (FBGA)||DR-4.27B||Apr 2014|
|Registration - Power Outline, Plastic Surface Mount C-Bend||DO-218C||Apr 2014|