Registered Outlines: JEP95

JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.

The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.

An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.

A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.

JEDEC Design Guides (was JESD95-1, now section 4 in JEP95)
Carrier Outlines (CO)
Carrier Standards (CS)
Diode Outline (DO)
Microelectronic Outline (MO)
Microelectronic Standards (MS)
Transistor Outline (TO)
Transistor Standards (TS)

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Related Committees and Subcommittees

JC-11Mechanical (Package Outlines) Standardization
JC-11.10Microelectronic Ceramic and Discrete Packages
JC-11.11Microelectronic Plastic Packages
JC-11.14Microelectronic Assemblies
JC-11.2Design Requirements
JC-11.4Uncased Devices
JC-11.7IEC Interface

Events and Meetings

JC-11 3 - 4 Jun 2015
JC-11 9 - 10 Dec 2015
JEDEC-wide Meeting 6 - 10 Jun 2016

Order JEP95 Hard Copy or Updates