JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
|Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM||MO-268E||Mar 2014|
|Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM||MO-310C||Feb 2014|
|Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50mm pitch Socket Outline||SO-018B||Feb 2014|
|Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT||SO-020A||Jan 2014|
|REGISTRATION - DDR4 DIMM Press Fit 288 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-019B||Jan 2014|
|Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-017B||Jan 2014|
|Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.||DG-4.7F||Jan 2014|
|Registration - Dual-Pitch, Thin and Very Thin Profile, Rectangular Die Size BGA, 0.80 mm X 0.65 mm Pitch. (T,V)FR-DSBGA||MO-311B||Dec 2013|
|Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM||MO-309C||Dec 2013|
|Standard Practices and Procedures - Package Variation Designators||SPP-025A||Dec 2013|