JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
|Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)||DO-201B||Nov 2013|
|Registration - Fine Pitch Ball Grid Array Family, Rectangular, 0.80 mm Pitch. (V,T,L)FR-XBGA.||MO-210M||Nov 2013|
|Registration - 240 Pin DDR3 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers. DIM||MO-269I||Nov 2013|
|Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS||MO-305C||Oct 2013|
|Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-016B||Sep 2013|
|Registration - Plastic Surface Mounted Header Family. H-PSIP-G.||TO-263F||Sep 2013|
|Registration - Plastic Thin Shrink Small Outline Package (Shrink SOT). TR-PDSO-G.||MO-193E||Jul 2013|
|Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA||MO-304D||Jul 2013|
|Design Requirements - Ball Grid Array Package (BGA).||DR-4.14G.02||Jul 2013|
|Registration - Fine Pitch Ball Grid Array Family, Rectangular , 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.||MO-276H||Jun 2013|