JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
|Registration - Fine Pitch Ball Grid Array Family, Rectangular, 0.80 mm Pitch. (V,T,L)FR-XBGA.||MO-210L||May 2013|
|Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA||MO-304C||Apr 2013|
|Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN)||DR-4.24A.1||Apr 2013|
|Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDX||MO-305B||Mar 2013|
|Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors||SPP-023B||Feb 2013|
|Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIM||MO-274C||Dec 2012|
|Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.||MO-269H||Dec 2012|
|REGISTRATION - DDR4 DIMM Press Fit 284 Pin Socket Outline, 0.85 mm Pitch. SKT||SO-019A||Dec 2012|
|Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline.||SO-008B||Oct 2012|
|Registration - Standard, Low, Thin, and Very Thin Profile, Rectangular Fine Pitch Ball Grid Array Family, 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.||MO-276G||Oct 2012|