JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
|Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch. TFR-XBGA.||MO-246G||Feb 2015|
|Design Requirements - Fine Pitch Ball Grid Array Package (FBGA)||DR-4.27C||Feb 2015|
|Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch||SO-021A||Feb 2015|
|Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA||MO-315A||Feb 2015|
|Design Requirements - Fine Pitch/Fine Pitch Interstitial Ball Grid Array Packages (FBGA) and (FIBGA)||DR-4.5J||Jan 2015|
|Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH||MO-314A||Jan 2015|
|Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.||MO-286B||Jan 2015|
|Registration - Fine Pitch Ball Grid Array Family, Rectangular , 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.||MO-276I||Dec 2014|
|Registration - Dual-Pitch, Thin and Very Thin Profile, Rectangular Die Size BGA, 0.80 mm X 0.65 mm Pitch. (T,V)FR-xDSBGA||MO-311D||Dec 2014|
|Standard - DDR4 DIMM Socket Insertion and Extraction Force Gauge||GS-010B||Nov 2014|