JEDEC remains committed to helping the electronics industry define standardized solutions to meet the technological challenges posed by the migration to lead-free materials.
Spurred by a 2003 European Union directive known as RoHS (Restriction of Hazardous Substances), the industry is undergoing one of the most significant shifts in manufacturing processes to occur in the last 50 years. The transition to the use of lead-free materials has redefined reliability concerns, and created a need for solutions to challenges involving moisture sensitivity, solderability and tin whisker mitigation practices, process controls and verification testing.
JEDEC collaborated with diverse organizations, including IPC, iNEMI and ECA to ensure needed documents were created as swiftly as possible to meet industry demand.
|JOINT JEDEC/ECA STANDARD, DEFINING “LOW-HALOGEN” ELECTRONIC PRODUCTS (REMOVAL OF BFR/CFR/PVC)||JS709A||May 2012|
|JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES||J-STD-033C||Jan 2012|
|MARKING AND LABELING OF COMPONENTS, PCBs AND PCBAs TO IDENTIFY LEAD (Pb), Pb-FREE AND OTHER ATTRIBUTES||J-STD-609A.01||Feb 2011|
|JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES||J-STD-020D.1||Mar 2008|
|MARKING, SYMBOLS, AND LABELS FOR IDENTIFICATION OF LEAD (Pb) FREE ASSEMBLIES, COMPONENTS, AND DEVICES - SUPERSEDED BY J-STD-609, August 2007||JESD97||May 2004|
|JC-14||Quality and Reliability of Solid State Products|
|JC-14.1||Reliability Test Methods for Packaged Devices|
|JC-14.3||Silicon Devices Reliability Qualification and Monitoring|
|JC-14.4||Quality Processes and Methods|
|JC-14.7||Gallium Arsenide Reliability and Quality Standards|