Lead-Free Manufacturing

Providing Solutions to a Complex Challenge

JEDEC remains committed to helping the electronics industry define standardized solutions to meet the technological challenges posed by the migration to lead-free materials.

Spurred by a 2003 European Union directive known as RoHS (Restriction of Hazardous Substances), the industry is undergoing one of the most significant shifts in manufacturing processes to occur in the last 50 years. The transition to the use of lead-free materials has redefined reliability concerns, and created a need for solutions to challenges involving moisture sensitivity, solderability and tin whisker mitigation practices, process controls and verification testing.

JEDEC collaborated with diverse organizations, including IPC, iNEMI and ECA to ensure needed documents were created as swiftly as possible to meet industry demand.

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Related Committees and Subcommittees

JC-14Quality and Reliability of Solid State Products
JC-14.1Reliability Test Methods for Packaged Devices
JC-14.2Wafer-Level Reliability
JC-14.3Silicon Devices Reliability Qualification and Monitoring
JC-14.4Quality Processes and Methods
JC-14.6Failure Analysis
JC-14.7Gallium Arsenide Reliability and Quality Standards

Events and Meetings

JC-14 13 - 15 May 2014
JC-14.7 19 May 2014
JC-14.2 5 - 6 Jun 2014
JC-14 16 - 19 Sep 2014
JC-14 13 - 15 Jan 2015