JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
|Registration - Ball Grid Array Family, Rectangle, 0.75 mm Pitch||MO-328A||Jan 2017|
|Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.||MS-034G||Jan 2017|
|Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA||MO-318B||Jan 2017|
|Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.||MO-234C||Jan 2017|
|Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON).||DG-4.20F||Sep 2016|
|Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF||MO-327A||Sep 2016|
|Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN)||DG-4.24B||Aug 2016|
|Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA)||DG-4.25B||Aug 2016|
|Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.||MO-302C||Aug 2016|
|Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA||MO-324A||Aug 2016|