JEDEC History - 2000s

As use of the Internet grew in the late 1990s, semiconductor sales rapidly expanded into communications and Internet infrastructure markets. But overly optimistic projections about the growth of the Internet didn’t materialize, and the bubble burst in 2001. Semiconductor sales, which had exceeded $200 billion in 2000, fell more than 30 percent to $139 billion in 2001. They wouldn’t reach $200 billion again until 2004.

At the same time, the chip market was becoming more global. In 2003, the European Union’s Restriction of Hazardous Substances Directive (RoHS) was approved. It took effect three years later. The directive, which restricted the use of six substances including lead, prompted the industry to adopt lead-free solders. As manufacturers switched to lead-free materials, JEDEC teamed with IPC – Association Connecting Electronics Industries as well as International Electronics Manufacturing Initiative (iNEMI) to develop or revise several standards to ensure quality and reliability of these new components and processes.

As developing nations such as China and India demanded more and more technology, international standards became ever more important. China – already the third largest market for chips – was the world's fastest growing market for semiconductors in 2003. In May 2008, JEDEC opened an office in Beijing. “We’ve been working hard over the last seven years to make inroads and relationships in China,” said John Kelly, JEDEC president. “Our goal is for China to be a part of the international standardization efforts of JEDEC.”

This decade saw many innovations in memory, including the development of double-data-rate (DDR) synchronous DRAM and flash devices. JEDEC was instrumental in developing standards for DDR synchronous DRAMs, which have become key components in PCs and servers. JEDEC also developed a range of DDR-based memory modules. Most recently, JEDEC published a standard for low-power double-data-rate memory.

JEDEC worked with the MultiMediaCard Association to develop standards for e•MMC™, an embedded non-volatile memory system used in a wide range of consumer electronics applications. In 2008, the MMCA merged with JEDEC, and its member companies became JEDEC members. “It changed the mix of JEDEC membership,” said Kelly. “We now represent more of the user community than at any time in JEDEC history.” In addition, JEDEC continues work in other innovative memory categories, including solid-state drives and universal flash storage.

As JEDEC enters its next fifty years, it will continue to play an influential role in the electronics industry. “The future of the semiconductor industry is the future of JEDEC,” said Kelly. “Semiconductors are the enablers of the digital revolution, and that revolution is only beginning.”

Timeline


2000

JEDEC publishes DDR spec – JESD-79.

Semiconductor sales exceed $200 billion.

Jack Kilby receives the Nobel Prize for his part in the invention of the integrated circuit.

2002

JEDEC and IPC release J-STD-020B and J-STD-033A, which cover moisture sensitivity during reflow of lead-free surface-mount devices.

2001

JEDEC and Advanced Memory International win PC Magazine’s “Technical Innovations Award for System Design” for the development of the double data rate synchronous memory (DDR SDRAM) standard.

JEDEC publishes the first edition of JESD88, a dictionary of terms for solid state technology. China accedes to the World Trade Organization.

2006

JEDEC and MultiMedia Card Association publish e•MMC™ standard for embedded flash memory applications.

European Union’s Restriction of Hazardous Substances Directive takes effect.

2007

Semiconductor sales hit a record $255.6 billion.

JEDEC publishes DDR3 SDRAM specification.

2008

Publication of ECA/IPC/JEDEC J-STD-075, a specification developed to solve problems that arose from the adoption of lead-free solder.

2009

JEDEC publishes LPDDR2 standard.

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