Committee Chairs

Chairmen of the JEDEC Committees (by Committee Number)
Committee Chairman Company
JC-10: Terms, Definitions, and Symbols Fred A. Mann  
JC-11: Mechanical (Package Outlines) Standardization Edmund Poh Molex Inc.
JC-11: Mechanical (Package Outlines) Standardization Ruben Fuentes
(Vice-Chair)
Amkor Technology
JC-11.1 Subcommittee: Editorial Practices and Procedures Dale Arnold Micron Technology
JC-11.2 Subcommittee: Design Requirements Glenn Koscal Carsem Inc.
JC-11.4 Subcommittee: Uncased Devices Christian Blair STMicroelectronics
JC-11.7 Subcommittee: IEC Interface Christine Blair STMicroelectronics
JC-11.10 Subcommittee: Microelectronic Ceramic Packages Serafin Pedron UGS America Sales Inc.
JC-11.11 Subcommittee: Microelectronic Plastic Packages Serafin Pedron UGS  America Sales Inc.
JC-11.14 Subcommittee: Microelectronic Assemblies John Lynch Intel Corporation
JC-13: Government Liaison Brent Rhoton Texas Instruments Inc.
JC-13.1 Subcommittee: Discrete Devices Chris Velador Semtech Corporation
JC-13.1 Subcommittee: Discrete Devices Huy Cao
(Vice-Chair)
International Recitfier
JC-13.2 Subcommittee: Microelectronic Devices Lee Mathiesen Lansdale Semiconductor Inc.
JC-13.2 Subcommittee: Microelectronic Devices Pat McCord
(Vice-Chair)
Minco Technolgy Labs Inc.
JC-13.4 Subcommittee: Radiation Hardness: Assurance and Characterization Reed Lawrence BAE Systems
JC-13.5 Subcommittee: Hybrid, RF/Microwave, and MCM Technology Daniel Miller M.S. Kennedy Corporation
JC-14: Quality and Reliability of Solid State Products Nick Lycoudes Freescale Semiconductor
JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices TBD  
JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices Ife Hsu
(Vice-Chair)
Intel Corporation 
JC-14.2 Subcommittee: Wafer-Level Reliability Fen Chen
 
IBM
JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring Ted Krueger Vishay Corporation
JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring Bob Knoell
(Vice-Chair)
NXP Semiconductors
JC-14.4 Subcommittee: Quality Processes and Methods Curtis Grosskopf IBM
JC-14.4 Subcommittee: Quality Processes and Methods Christine Blair
(Vice-Chair)
STMicroelectronics
JC-14.7 Subcommittee: Gallium Arsenide Reliability and Quality Standards Peter Ersland M/A-COM Technology Solutions
JC-15: Thermal Characterization Techniques for Semiconductor Packages  Bruce Guenin Oracle America Inc.
JC-15: Thermal Characterization Techniques for Semiconductor Packages  Roger Emigh
(Vice-Chair)
STATS-ChipPAC
JC-16: Interface Technology  Doug Stout IBM Corporation
JC-16: Interface Technology  Roleof Salters
(Vice-Chair)
NXP Semiconductors
JC-22: Diodes and Thyristors Kent Walters Microsemi Corporation
JC-22.2/22.4 Subcommittee: Rectifiers, Zeners and Signal Diodes Kent Walters Microsemi Corporation
JC-22.5 Subcommittee: Transient Voltage Suppressors William Travis Littelfuse Inc.
JC-25: Transistors Ray DiBugnara Microsemi Corporation
JC-40: Digital Logic Joe Quddus Montage Technology Group Ltd. 
JC-40: Digital Logic Ahmed Noeman
(Vice-Chair)
Texas Instruments Inc.
JC-40.1 Subcommittee: Digital Logic Families and Applications  Ricki Williams Oracle America Inc.
JC-40.4 Subcommittee: FBDIMM Support Components Chris Haywood Inphi Corporation
JC-40.5 Subcommittee: Logic Validation and Verification  Perry Keller Agilent Technologies
JC-42: Solid State Memories Desi Rhoden Montage Technology Group Ltd.
JC-42: Solid State Memories Jang Seok Choi
(Vice-Chair)
Samsung Semiconductor
JC-42.2 Subcommittee: SRAM Memories  Gary Fleeman Advantest Corporation
JC-42.2 Subcommittee: SRAM Memories Dinesh Maheshwari
(Vice-Chair)
Cypress Semiconductor
JC-42.3 Subcommittee: DRAM Memories Joe Macri Advanced Micro Devices Inc.
JC-42.3 Subcommittee: DRAM Memories Clement Fang
(Vice-Chair)
Oracle America Inc.
JC-42.3B Letter Committee on DRAM Functions and Features Kevin Ryan Micron Technology Inc.
JC-42.3B Letter Committee on DRAM Functions and Features Dr. William Shen
(Vice-Chair)
Taiwan Semiconductor Mfg Company
JC-42.3C Letter Committee on DRAM Timing Jang Seok Choi Samsung Semiconductor
JC-42.3C Letter Committee on DRAM Timing Eugene Kim
(Vice-Chair)
SK hynix
JC-42.4 Subcommittee: Non-Volatile Memory Devices Cecil Ho CST Inc.
JC-42.4 Subcommittee: Non-Volatile Memory Devices Frank Chu
(Vice-Chair)
HGST
JC-42.6 Subcommittee: Low Power Memories Hung Vuong Qualcomm Inc.
JC-42.6 Subcommittee: Low Power Memories Dan Skinner
(Co-Vice-Chair)
Micron Technology
JC-42.6 Subcommittee: Low Power Memories JY Choi
(Co-Vice-Chair)
Samsung Semiconductor
JC-45: DRAM Modules Mian Quddus Samsung Semiconductor
JC-45: DRAM Modules Peter Linder
(Vice-Chair)
Nanya Technology Corporation
JC-45.1 Subcommittee: Registered DRAM Modules Takao Ono Elpida Memory Incorporated
JC-45.1 Subcommittee: Registered DRAM Modules Jonathan Hinkle
(Vice-Chair)
Viking  Modular Solution
JC-45.3 Subcommittee: Small DRAM Modules Kazuyoshi Tsukada  Buffalo Inc.
JC-45.3 Subcommittee: Small DRAM Modules Jae Han Park
(Vice-Chair)
SK Hynix
JC-45.4 Subcommittee: Fully Buffered DRAM Modules Won Hyung Song Samsung Semiconductor
JC-45.4 Subcommittee: Fully Buffered DRAM Modules Joe Quddus
(Vice-Chair)
Montage Technology Group Ltd.
JC-45.5 Subcommittee: Module Interconnect Ricki Williams Oracle America Inc.
JC-45.5 Subcommittee: Module Interconnect Jim McGrath
(Vice-Chair)
TE Connectivity
JC-45.6 Subcommittee: Hybrid Modules Chris Socci PNY Technologies Inc.
JC-45.6 Subcommittee: Hybrid Modules Kelvin Marino
(Vice-Chair)
Smart Modular Technologies Inc.
JC-63: Multiple Chip Packages James Malatesta Micron Technology Inc.
JC-63: Multiple Chip Packages Patrick Moran
(Vice-Chair)
Qualcomm Inc.
JC-64: Embedded Memory Storage and Removable Memory Cards Mian Quddus Samsung Semiconductor
JC-64: Embedded Memory Storage and Removable Memory Cards Victor Tsai
(Vice-Chair)
Micron Technology Inc.
JC-64.1 Subcommittee: Electrical Specifications and Command Protocols Hung Vuong Qualcomm Inc.
JC-64.1 Subcommittee: Electrical Specifications and Command Protocols Sven Hegner
(Co-Vice-Chair)
Toshiba  
JC-64.1 Subcommittee: Electrical Specifications and Command Protocols HeeChang Cho
(Co-Vice-Chair)
Samsung Semiconductor
JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies Dr. Mostafa Abdulla Micron Technology Inc.
JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies Seungmin Oh
(Co-Chair)
SK Hynix
JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies Howard Sussman
(Co-Vice-Chair)
On Semiconductor
JC-64.5 Subcommittee: UFS Measurement Perry Keller Agilent Technologies
JC-64.5 Subcommittee: UFS Measurement Seungyong Shin
(Vice-Chair)
Samsung Semiconductor
JC-64.8 Subcommittee: Solid State Drives (SSD) Alvin Cox Seagate Technology LLC
JC-64.8 Subcommittee: Solid State Drives (SSD) Frank Chu
(Vice-Chair)
HGST
JC-64.9 Subcommittee: Wireless Memory Graziano Mirichigni Micron Technology Inc.
JC-64.9 Subcommittee: Wireless Memory Kyungyong Jeoung
(Co-Vice-Chair)
Samsung Semiconductor
JC-64.9 Subcommittee: Wireless Memory Roelof Salters
(Co-Vice-Chair)
NXP Semiconductors
JC-64.9 Subcommittee: Wireless Memory Martti Voutilainen
(Co-Vice-Chair)
Nokia
JC-65: Radio Frequency Identification Tags (RFIDs) Navin Bhandarkar Texas Instruments Inc.
JC-65: Radio Frequency Identification Tags (RFIDs) Sylvain Fidelis
(Vice-Chair)
STMicroelectronics

 

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