| JC-10: Terms, Definitions, and Symbols |
Fred A. Mann |
|
| JC-11: Mechanical (Package Outlines) Standardization |
Takao Ono |
Elpida Memory Inc. |
| JC-11: Mechanical (Package Outlines) Standardization |
Rudy Griffin
(Vice-Chair) |
National Semiconductor Corporation |
| JC-11.2 Subcommittee: Design Requirements |
Glenn Koscal |
Carsem Inc. |
| JC-11.4 Subcommittee: Uncased Devices |
Michael Ahr |
Infineon Technologies |
| JC-11.7 Subcommittee: IEC Interface |
Christine Blair |
STMicroelectronics |
| JC-11.10 Subcommittee: Microelectronic Ceramic Packages |
Inactive |
|
| JC-11.11 Subcommittee: Microelectronic Plastic Packages |
Serafin Pedron |
ASAT Inc. |
| JC-11.14 Subcommittee: Microelectronic Assemblies |
John Lynch |
Intel Corporation |
| JC-13: Government Liaison |
Brent Rhoton |
Texas Instruments, Inc. |
| JC-13.1 Subcommittee: Discrete Devices |
Chris Velador |
Semtech Corporation |
| JC-13.1 Subcommittee: Discrete Devices |
Carl Mowry
(Vice-Chair) |
Microsemi Corporation |
| JC-13.2 Subcommittee: Microelectronic Devices |
Lee Mathiesen |
Lansdale Semiconductor Inc. |
| JC-13.2 Subcommittee: Microelectronic Devices |
Craig Taylor
(Vice-Chair) |
Xilinx, Inc. |
| JC-13.4 Subcommittee: Radiation Hardness: Assurance and Characterization |
Reed Lawrence |
BAE Systems |
| JC-13.5 Subcommittee: Hybrid, RF/Microwave, and MCM Technology |
Daniel Miller |
M.S. Kennedy Corporation |
| JC-13.6 Subcommittee: Fiber Optics Systems in Military and Space Applications |
Chuck Tabbert |
Ultra Communications Inc. |
| JC-14: Quality and Reliability of Solid State Products |
Nick Lycoudes |
Freescale Semiconductor |
| JC-14: Quality and Reliability of Solid State Products |
Peter Scala
(Vice-Chair) |
Renesas Technology America Inc. |
| JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices |
Jack McCullen |
Intel Corporation |
| JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices |
Larry Nye
(Vice-Chair) |
Texas Instruments, Inc. |
| JC-14.2 Subcommittee: Wafer-Level Reliability |
Dan Oliver |
NXP Semiconductors |
| JC-14.2 Subcommittee: Wafer-Level Reliability |
Andreas Martin
(Co-Vice-Chair) |
Infineon |
| JC-14.2 Subcommittee: Wafer-Level Reliability |
David Roy
(Co-Vice-Chair) |
STMicroelectronics |
| JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring |
Ted Krueger |
Vishay Corporation |
| JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring |
Bruce Euzent
(Vice-Chair) |
Altera Corporation |
| JC-14.4 Subcommittee: Quality Processes and Methods |
Curtis Grosskopf |
IBM |
| JC-14.4 Subcommittee: Quality Processes and Methods |
Christine Blair
(Vice-Chair) |
STMicroelectronics |
| JC-14.6 Subcommittee: Failure Analysis |
TBD |
|
| JC-14.7 Subcommittee: Gallium Arsenide Reliability and Quality Standards |
Peter Ersland |
M/A-COM Technology Solutions |
| JC-15: Electrical and Thermal Characterization Techniques for Electronic Packages and Interconnects |
Bruce Guenin |
Sun Microsystems |
| JC-16: Voltage Level and Electrical Interface |
Doug Stout |
IBM Corporation |
| JC-16: Voltage Level and Electrical Interface |
Roleof Salters
(Vice-Chair) |
NXP Semiconductors |
| JC-22: Diodes and Thyristors |
Kent Walters |
Microsemi Corporation |
| JC-22.1 Subcommittee: Thyristors |
Inactive |
|
| JC-22.2/22.4 Subcommittee: Rectifiers, Zeners and Signal Diodes |
Kent Walters |
Microsemi Corporation |
| JC-22.5 Subcommittee: Transient Voltage Suppressors |
William Travis |
Littelfuse, Inc. |
| JC-25: Transistors |
Ray DiBugnara |
Microsemi Corporation |
| JC-40: Digital Logic |
John Smolka |
Silego Technology, Inc. |
| JC-40: Digital Logic |
Joe Quddus
(Vice-Chair) |
Montage Technology Group Ltd. |
| JC-40.1 Subcommittee: CMOS/BiCMOS Digital Logic |
Rick Williams |
Sun Microsystems |
| JC-40.3 Subcommittee: RDIMM Support Devices |
Ramzi Ammar |
Silego Technology, Inc. |
| JC-40.3 Subcommittee: RDIMM Support Devices |
Ingolf Frank
(Vice-Chair) |
Texas Instruments, Inc. |
| JC-40.4 Subcommittee: FBDIMM Support Devices |
Jeffrey Chung |
Silego Technology, Inc. |
| JC-40.4 Subcommittee: FBDIMM Support Devices |
Christian Harrieder
(Vice-Chair) |
Texas Instruments, Inc. |
| JC-40.5 Subcommittee: Logic Verification and Validation |
Perry Keller |
Agilent Technologies |
| JC-42: RAM Memory |
Desi Rhoden |
Montage Technology Group Ltd. |
| JC-42: RAM Memory |
Scott Graham
(Vice-Chair) |
Micron Technology, Inc. |
| JC-42.2 Subcommittee: SRAM |
Gary Fleeman |
Advantest Corporation |
| JC-42.2 Subcommittee: SRAM |
Dinesh Maheshwari
(Vice-Chair) |
Cypress Semiconductor |
| JC-42.3 Subcommittee: Volatile RAM |
Joe Macri |
Advanced Micro Devices, Inc. |
| JC-42.3 Subcommittee: Volatile RAM |
Clement Fang
(Vice-Chair) |
Sun Microsystems |
| JC-42.3B Letter Subcommittee: RAM Functions and Features |
Kevin Ryan |
Micron Technology, Inc. |
| JC-42.3B Letter Subcommittee: RAM Functions and Features |
Dr. William Shen
(Vice-Chair) |
LSI Corporation |
| JC-42.3C Letter Subcommittee:RAM Parametrics |
Todd Farrell |
Micron Technology, Inc. |
| JC-42.3C Letter Subcommittee:RAM Parametrics |
Jang Seok Choi
(Vice-Chair) |
Samsung Semiconductor |
| JC-42.3D Letter Subcommittee: RAM Package Pinouts |
Mario Martinez |
Netlist Inc. |
| JC-42.3D Letter Subcommittee: RAM Package Pinouts |
TBD
(Vice-Chair) |
|
| JC-42.4 Subcommittee: Non-Volatile Memory |
Dong Yang Lee |
Samsung Semiconductor |
| JC-42.4 Subcommittee: Non-Volatile Memory |
Cecil Ho
(Vice-Chair) |
CST Inc. |
| JC-42.6 Subcommittee: Low Power Memory |
Sophie Dumas |
STMicroelectronics |
| JC-42.6 Subcommittee: Low Power Memory |
Roger Isaac
(Vice-Chair) |
Silicon Image Inc. |
| JC-45: Memory Modules |
Mian Quddus |
Samsung Semiconductor |
| JC-45: Memory Modules |
Peter Linder
(Vice-Chair) |
Nanya Technology Corporation |
| JC-45.1 Subcommittee: R-DIMM |
Oliver Kiehl |
Infineon |
| JC-45.1 Subcommittee: R-DIMM |
Takao Ono
(Vice-Chair) |
Elpida Memory Incorporated |
| JC-45.2 Subcommittee: U-DIMM |
TBD |
|
| JC-45.2 Subcommittee: U-DIMM |
Yongshin Kim
(Vice-Chair) |
Hynix Semiconductor |
| JC-45.3 Subcommittee: Small DIMM |
Kazuyoshi Tsukada |
Buffalo Inc. |
| JC-45.3 Subcommittee: Small DIMM |
Sung Joo Park
(Vice-Chair) |
Samsung Semiconductor |
| JC-45.4 Subcommittee: FB-DIMM |
Paul Goodwin |
Avant Technology |
| JC-45.4 Subcommittee: FB-DIMM |
Joe Quddus
(Vice-Chair) |
Montage Technology Group Ltd. |
| JC-45.5 Subcommittee: Module Interconnect |
Bill Gervasi |
Form Factor, Inc. |
| JC-45.5 Subcommittee: Module Interconnect |
Mario Martinez
(Vice-Chair) |
Netlist Inc. |
| JC-63: Multiple Chip Package |
James Malatesta |
Numonyx B.V. |
| JC-63: Multiple Chip Package |
Dong Yang Lee
(Vice-Chair) |
Samsung Semiconductor |
| JC-64: Flash Memory Module |
Mian Quddus |
Samsung |
| JC-64: Flash Memory Module |
Dave Eggleston
(Vice-Chair) |
Unity Semiconductor |
| JC-64.1 Subcommittee: Electrical Specifications |
Kimmo Mylly |
Nokia Corporation |
| JC-64.1 Subcommittee: Electrical Specifications |
Victor Tsai
(Co-Vice-Chair) |
Micron Technology Inc. |
| JC-64.1 Subcommittee: Electrical Specifications |
Sung Lee
(Co-Vice-Chair) |
Samsung Semiconductor |
| JC-64.2 Subcommittee: Mechanical Outlines |
Mostafa Abdulla |
Numonyx B.V. |
| JC-64.2 Subcommittee: Mechanical Outlines |
TBD
(Vice-Chair) |
|
| JC-64.3 Subcommittee: Host Controller |
Perry Keller |
Agilent Technologies |
| JC-64.3 Subcommittee: Host Controller |
Dinesh Maheshwari
(Co-Vice-Chair) |
Cypress Semiconductor |
| JC-64.3 Subcommittee: Host Controller |
Hung Vuong
(Co-Vice-Chair) |
Qualcomm Inc. |
| JC-64.8 Subcommittee: Solid State Disk (SSD) |
Alvin Cox |
Seagate Technology LLC |
| JC-64.8 Subcommittee: Solid State Disk (SSD) |
Scott Graham
(Vice-Chair) |
Micron Technology, Inc. |
| JC-65: RFID |
Navin Bhandarkar |
Texas Instruments, Inc. |
| JC-65: RFID |
Sylvain Fidelis
(Vice-Chair) |
STMicroelectronics |
