| JC-10: Terms, Definitions, and Symbols |
Fred A. Mann |
|
| JC-11: Mechanical (Package Outlines) Standardization |
Edmund Poh |
Molex Inc. |
| JC-11: Mechanical (Package Outlines) Standardization |
Ruben Fuentes
(Vice-Chair) |
Amkor Technology |
| JC-11.1 Subcommittee: Editorial Practices and Procedures |
Dale Arnold |
Micron Technology |
| JC-11.2 Subcommittee: Design Requirements |
Glenn Koscal |
Carsem Inc. |
| JC-11.4 Subcommittee: Uncased Devices |
Christian Blair |
STMicroelectronics |
| JC-11.7 Subcommittee: IEC Interface |
Christine Blair |
STMicroelectronics |
| JC-11.10 Subcommittee: Microelectronic Ceramic Packages |
Serafin Pedron |
UGS America Sales Inc. |
| JC-11.11 Subcommittee: Microelectronic Plastic Packages |
Serafin Pedron |
UGS America Sales Inc. |
| JC-11.14 Subcommittee: Microelectronic Assemblies |
John Lynch |
Intel Corporation |
| JC-13: Government Liaison |
Brent Rhoton |
Texas Instruments Inc. |
| JC-13.1 Subcommittee: Discrete Devices |
Chris Velador |
Semtech Corporation |
| JC-13.1 Subcommittee: Discrete Devices |
Huy Cao
(Vice-Chair) |
International Recitfier |
| JC-13.2 Subcommittee: Microelectronic Devices |
Lee Mathiesen |
Lansdale Semiconductor Inc. |
| JC-13.2 Subcommittee: Microelectronic Devices |
Pat McCord
(Vice-Chair) |
Minco Technolgy Labs Inc. |
| JC-13.4 Subcommittee: Radiation Hardness: Assurance and Characterization |
Reed Lawrence |
BAE Systems |
| JC-13.5 Subcommittee: Hybrid, RF/Microwave, and MCM Technology |
Daniel Miller |
M.S. Kennedy Corporation |
| JC-14: Quality and Reliability of Solid State Products |
Nick Lycoudes |
Freescale Semiconductor |
| JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices |
TBD |
|
| JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices |
Ife Hsu
(Vice-Chair) |
Intel Corporation |
| JC-14.2 Subcommittee: Wafer-Level Reliability |
Fen Chen
|
IBM |
| JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring |
Ted Krueger |
Vishay Corporation |
| JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring |
Bob Knoell
(Vice-Chair) |
NXP Semiconductors |
| JC-14.4 Subcommittee: Quality Processes and Methods |
Curtis Grosskopf |
IBM |
| JC-14.4 Subcommittee: Quality Processes and Methods |
Christine Blair
(Vice-Chair) |
STMicroelectronics |
| JC-14.7 Subcommittee: Gallium Arsenide Reliability and Quality Standards |
Peter Ersland |
M/A-COM Technology Solutions |
| JC-15: Thermal Characterization Techniques for Semiconductor Packages |
Bruce Guenin |
Oracle America Inc. |
| JC-15: Thermal Characterization Techniques for Semiconductor Packages |
Roger Emigh
(Vice-Chair) |
STATS-ChipPAC |
| JC-16: Interface Technology |
Doug Stout |
IBM Corporation |
| JC-16: Interface Technology |
Roleof Salters
(Vice-Chair) |
NXP Semiconductors |
| JC-22: Diodes and Thyristors |
Kent Walters |
Microsemi Corporation |
| JC-22.2/22.4 Subcommittee: Rectifiers, Zeners and Signal Diodes |
Kent Walters |
Microsemi Corporation |
| JC-22.5 Subcommittee: Transient Voltage Suppressors |
William Travis |
Littelfuse Inc. |
| JC-25: Transistors |
Ray DiBugnara |
Microsemi Corporation |
| JC-40: Digital Logic |
Joe Quddus |
Montage Technology Group Ltd. |
| JC-40: Digital Logic |
Ahmed Noeman
(Vice-Chair) |
Texas Instruments Inc. |
| JC-40.1 Subcommittee: Digital Logic Families and Applications |
Ricki Williams |
Oracle America Inc. |
| JC-40.4 Subcommittee: FBDIMM Support Components |
Chris Haywood |
Inphi Corporation |
| JC-40.5 Subcommittee: Logic Validation and Verification |
Perry Keller |
Agilent Technologies |
| JC-42: Solid State Memories |
Desi Rhoden |
Montage Technology Group Ltd. |
| JC-42: Solid State Memories |
Jang Seok Choi
(Vice-Chair) |
Samsung Semiconductor |
| JC-42.2 Subcommittee: SRAM Memories |
Gary Fleeman |
Advantest Corporation |
| JC-42.2 Subcommittee: SRAM Memories |
Dinesh Maheshwari
(Vice-Chair) |
Cypress Semiconductor |
| JC-42.3 Subcommittee: DRAM Memories |
Joe Macri |
Advanced Micro Devices Inc. |
| JC-42.3 Subcommittee: DRAM Memories |
Clement Fang
(Vice-Chair) |
Oracle America Inc. |
| JC-42.3B Letter Committee on DRAM Functions and Features |
Kevin Ryan |
Micron Technology Inc. |
| JC-42.3B Letter Committee on DRAM Functions and Features |
Dr. William Shen
(Vice-Chair) |
Taiwan Semiconductor Mfg Company |
| JC-42.3C Letter Committee on DRAM Timing |
Jang Seok Choi |
Samsung Semiconductor |
| JC-42.3C Letter Committee on DRAM Timing |
Eugene Kim
(Vice-Chair) |
SK hynix |
| JC-42.4 Subcommittee: Non-Volatile Memory Devices |
Cecil Ho |
CST Inc. |
| JC-42.4 Subcommittee: Non-Volatile Memory Devices |
Frank Chu
(Vice-Chair) |
HGST |
| JC-42.6 Subcommittee: Low Power Memories |
Hung Vuong |
Qualcomm Inc. |
| JC-42.6 Subcommittee: Low Power Memories |
Dan Skinner
(Co-Vice-Chair) |
Micron Technology |
| JC-42.6 Subcommittee: Low Power Memories |
JY Choi
(Co-Vice-Chair) |
Samsung Semiconductor |
| JC-45: DRAM Modules |
Mian Quddus |
Samsung Semiconductor |
| JC-45: DRAM Modules |
Peter Linder
(Vice-Chair) |
Nanya Technology Corporation |
| JC-45.1 Subcommittee: Registered DRAM Modules |
Takao Ono |
Elpida Memory Incorporated |
| JC-45.1 Subcommittee: Registered DRAM Modules |
Jonathan Hinkle
(Vice-Chair) |
Viking Modular Solution |
| JC-45.3 Subcommittee: Small DRAM Modules |
Kazuyoshi Tsukada |
Buffalo Inc. |
| JC-45.3 Subcommittee: Small DRAM Modules |
Jae Han Park
(Vice-Chair) |
SK Hynix |
| JC-45.4 Subcommittee: Fully Buffered DRAM Modules |
Won Hyung Song |
Samsung Semiconductor |
| JC-45.4 Subcommittee: Fully Buffered DRAM Modules |
Joe Quddus
(Vice-Chair) |
Montage Technology Group Ltd. |
| JC-45.5 Subcommittee: Module Interconnect |
Ricki Williams |
Oracle America Inc. |
| JC-45.5 Subcommittee: Module Interconnect |
Jim McGrath
(Vice-Chair) |
TE Connectivity |
| JC-45.6 Subcommittee: Hybrid Modules |
Chris Socci |
PNY Technologies Inc. |
| JC-45.6 Subcommittee: Hybrid Modules |
Kelvin Marino
(Vice-Chair) |
Smart Modular Technologies Inc. |
| JC-63: Multiple Chip Packages |
James Malatesta |
Micron Technology Inc. |
| JC-63: Multiple Chip Packages |
Patrick Moran
(Vice-Chair) |
Qualcomm Inc. |
| JC-64: Embedded Memory Storage and Removable Memory Cards |
Mian Quddus |
Samsung Semiconductor |
| JC-64: Embedded Memory Storage and Removable Memory Cards |
Victor Tsai
(Vice-Chair) |
Micron Technology Inc. |
| JC-64.1 Subcommittee: Electrical Specifications and Command Protocols |
Hung Vuong |
Qualcomm Inc. |
| JC-64.1 Subcommittee: Electrical Specifications and Command Protocols |
Sven Hegner
(Co-Vice-Chair) |
Toshiba |
|
| JC-64.1 Subcommittee: Electrical Specifications and Command Protocols |
HeeChang Cho
(Co-Vice-Chair) |
Samsung Semiconductor |
| JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies |
Dr. Mostafa Abdulla |
Micron Technology Inc. |
| JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies |
Seungmin Oh
(Co-Chair) |
SK Hynix |
| JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies |
Howard Sussman
(Co-Vice-Chair) |
On Semiconductor |
| JC-64.5 Subcommittee: UFS Measurement |
Perry Keller |
Agilent Technologies |
| JC-64.5 Subcommittee: UFS Measurement |
Seungyong Shin
(Vice-Chair) |
Samsung Semiconductor |
| JC-64.8 Subcommittee: Solid State Drives (SSD) |
Alvin Cox |
Seagate Technology LLC |
| JC-64.8 Subcommittee: Solid State Drives (SSD) |
Frank Chu
(Vice-Chair) |
HGST |
| JC-64.9 Subcommittee: Wireless Memory |
Graziano Mirichigni |
Micron Technology Inc. |
| JC-64.9 Subcommittee: Wireless Memory |
Kyungyong Jeoung
(Co-Vice-Chair) |
Samsung Semiconductor |
| JC-64.9 Subcommittee: Wireless Memory |
Roelof Salters
(Co-Vice-Chair) |
NXP Semiconductors |
| JC-64.9 Subcommittee: Wireless Memory |
Martti Voutilainen
(Co-Vice-Chair) |
Nokia |
| JC-65: Radio Frequency Identification Tags (RFIDs) |
Navin Bhandarkar |
Texas Instruments Inc. |
| JC-65: Radio Frequency Identification Tags (RFIDs) |
Sylvain Fidelis
(Vice-Chair) |
STMicroelectronics |
