JEDEC has announced the opening of an office in Beijing, China as of May 2, 2008.  The JEDEC office is co-located with the China office of the Consumer Electronics Association (CEA). 

The head of the JEDEC office and JEDEC's chief representative in China is Xianmin Xi.  Mr. Xi previously worked with the U.S. Information Technology Organization (USITO).  Prior to USITO, Mr. Xi spent 10 years as an information technology specialist with the Commercial Service of the U.S. Embassy in Beijing.  See attached release for additional details.

JEDEC recently published the Low Power Double Data Rate (LPDDR) Non-Volatile Memory (NVM) Specification for Flash memory chips. For the first time, SDRAM and NVM traffic can be interleaved efficiently on a shared bus without arbitration, to reduce cost and dramatically improve performance in mobile devices.

The Electronic Industries Alliance (EIA), the JEDEC Solid State Technology Association (JEDEC), and the Japan Green Procurement Survey Standardization Initiative (JGPSSI) have revised the tool that provides businesses across the supply chain with more reliable information on the regulated materials contained in electronic products and components.  See the attached release for details.

Temperatures are running hot in the computing industry as engineers struggle with rising thermal profiles for computer memory while form factors are getting ever smaller.  JEDEC has given some relief to system designers with committee approval of the TSE2002 Serial Presence Detect (SPD) with Thermal Sensor.  The approved specification is expected to be available by mid-November 2007.

Today, JEDEC has announced that it has initiated standardization for the Solid State Drive (SSD) segment of the computer industry.  This nascent market is poised for explosive growth as the price gap between rotating media hard disks and non-volatile alternatives such as flash drives decreases.  See attached release for details.

The JEDEC Solid State Technology Association (JEDEC) today announced that it has begun work on a next-generation card/embedded specification that will support higher performance and greater efficiencies when flash memory is used in consumer electronics and PCs. The new specification, Universal Flash Storage (UFS), will become an industry-wide interface standard encompassing all removable flash cards and embedded memory that supports booting as well as host system input and output interfaces.  

Participation of JEDEC in the upcoming MemCon event in San Jose, California, on July 17-19, 2007.

PUBLICATION OF JEDEC DDR3 SDRAM STANDARD

Arlington, VA - June 26, 2007 - The JEDEC Solid State Technology Association announced today that it has completed development and publication of the DDR3 (Double Data Rate 3) memory device standard, which can now be found and downloaded at no charge from the JEDEC website (www.jedec.org).

Arlington, VA - April 30, 2007 - JEDEC presented its first international awards of distinction to two senior officials of the China Semiconductor Industry Association (CSIA) at a ceremony in Beijing, China.

See Picture of the ceremony

JEDEC Elects HP Representative to Join Board of Directors

Arlington, VA – March 28, 2007 – JEDEC Board of Directors today announced its decision to elect Belal Gharaibeh, corporate procurement engineer at HP, to serve as representative on its board.

JEDEC Adopts DDR2 32b SO-DIMM Design Specification

JEDEC Adopts Definitions of EE1002 and EE1002A Serial Presence Detect EEPROM

MultiMediaCard Association (MMCA) and the JEDEC Solid State Technology Association (JEDEC) Announce eMMC™ for Embedded Flash Memory Applications

RF/BB standard JESD96 that was released on 5/4/04