CHAIR: Dottie Fields-Jones, Microsemi Corporation


JC-13.1 met on May 17, 2000. There are currently seven (7) active task groups:

TG 9802 - Requalification Tables - Work is continuing in this area.
TG 9812 - TM2074 Internal Visual for Diodes - The results of the task group deliberations will be sent out for ballot.
TG 9813 - TM2073 Die Visual Inspection - The task group's efforts are being forwarded to DSCC to be placed in the next draft of MIL-STD-750, Notice 4.  The task group was retired.
TG 9903 - Environmental Controls - Recommended changes will be sent out as a ballot to the task group members.
TG 9904 - TM1018 RGA - This is now a joint task group between
JC-13.1 and G-12. The test labs are working with the task group to establish a workable test method for the 'UB' package.
TG 9905 - Procedures for Conformal Coating. -The task group's work has expanded to include more than conformal coatings; therefore, the task group name has been changed to 'Cracked glass criteria'.  The task group will also review the external visual criteria in TM 2071.
TG 9906 - Review of MIL-HDBK-6100 - The specification is to be canceled, and the task group has been retired.  DSCC will review packages for standardization and inclusion in MIL-STD-1835.

A new task group (2001) was added which will generate a procedure for standardizing the calculation of Junction temperature.

CHAIR: Brent Rhoton, Texas Instruments


The following liaison reports were presented:

NWSC/Crane - Tom Davidson reported on revision 2 of the NavSea Part Requirement and Application Manual dated January 3, 2000.

Aerospace Corporation  - Larry Harzstack gave an update on activities and requested help from JC-13.2 in updating Method 2018 for new technologies.

NASA/JPL -  Dave Peters presented a new parts matrix showing potential risk levels for different classes of devices when used in flight applications.  Mr. Peters also reported that estimated losses due to the "faster, better, cheaper" initiative have totaled over $6 billion, and that part procurement methodologies are being reviewed.

DSCC - Ray Monnin reported on updates to MIL-PRF-38535, MIL-STD-883 and MIL-STD-1835.  Topics of discussion included adding a non-microcircuit outline to MIL-STD-1835 and a possible rewrite of "QD" requirements for diminishing sources.  A joint task group was formed with G-12 to revisit "QD" requirements, to be chaired by Ken Finney of Boeing.

Changes were discussed and approved to:

  • -  Make a wording change to clarify requirements for class 1 change notification for non-QML suppliers in MIL-PRF-1835.
  • -  Change Method 2010 to clarify visual requirements for inspection of wire clearance.
  • -  Allow inclusion of radiation test circuits to be optional in SMDs and Slash Sheets as allowed for Burn-in circuits.

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